Browsing by Author "Shekhawat, Gajendra"

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    Contrast Mechanisms on Nanoscale Subsurface Imaging in Ultrasonic AFM: Scattering of Ultrasonic Wave and Contact Stiffness of Tip-Sample
    (Royal Society of Chemistry, 2017-01-13) Sharahi, Hossein J; Shekhawat, Gajendra; Dravid, Vinayak; Park, Simon; Egberts, Philip; Kim, Seonghwan
    Ultrasonic atomic force microscopy (AFM) and its associated derivatives are nondestructive techniques that can elucidate subsurface nanoscale structures and properties. Despite the usefulness of these techniques, the physical contrast mechanisms responsible for the reported subsurface features observed in ultrasonic AFM are not well defined. In this study, we present a comprehensive model combining ultrasonic wave scattering and tip–sample contact stiffness to better reproduce the experimentally measured phase variations over subsurface features in two model systems. These model systems represent the two extreme sample types typically imaged by ultrasonic AFM, one being a hard material and the other a soft polymeric material. The theoretical analysis presented and associated comparisons with experimental results suggest that the image contrast depends on the combination of two contrast mechanisms: the perturbation of the scattered ultrasonic waves and the local variation of the contact stiffness at the tip–sample contact. The results of this study open up a new door for the depth estimation of buried nanoscale features into hard (engineering structures) and soft (polymers and biological structures) materials, and eventually lead to non-invasive, high-resolution 3D nano-tomography by ultrasonic AFM.
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    Micromachined Chip Scale Thermal Sensor for Thermal Imaging
    (American Chemical Society, 2018-02-05) Shekhawat, Gajendra; Ramachandran, Srinivasan; Jiryaei Sharahi, Hossein; Sarkar, Souravi; Hujsak, Karl; Li, Yuan; Hagglund, Karl; Kim, Seonghwan; Aden, Gary; Chand, Ami; Dravid, Vinayak
    The lateral resolution of scanning thermal microscopy (SThM) has hitherto never approached that of mainstream atomic force microscopy, mainly due to poor performance of the thermal sensor. Herein, we report a nanomechanical system-based thermal sensor (thermocouple) that enables high lateral resolution that is often required in nanoscale thermal characterization in a wide range of applications. This thermocouple-based probe technology delivers excellent lateral resolution (∼20 nm), extended high-temperature measurements >700 °C without cantilever bending, and thermal sensitivity (∼0.04 °C). The origin of significantly improved figures-of-merit lies in the probe design that consists of a hollow silicon tip integrated with a vertically oriented thermocouple sensor at the apex (low thermal mass) which interacts with the sample through a metallic nanowire (50 nm diameter), thereby achieving high lateral resolution. The efficacy of this approach to SThM is demonstrated by imaging embedded metallic nanostructures in silica core–shell, metal nanostructures coated with polymer films, and metal–polymer interconnect structures. The nanoscale pitch and extremely small thermal mass of the probe promise significant improvements over existing methods and wide range of applications in several fields including semiconductor industry, biomedical imaging, and data storage.